Foundation IP

Standard Cell

Chip Difffferentiation

◆ Support TSMC 3nm, 5nm, 7nm, 12nm, 16nm, 28/22nm 

◆ Characterization (re-K) for many voltages @T16, 12, 10, 7, 5, 4, 3nm


Power


◆ Multi-Bit Flip-Flop (-20~30% power) 

◆ Low-Power ICG (-20~30% power) 

◆ 1-inv Flip-Flop (-40% power) 

◆ Low-Power Comb. (-20~30% power) 

◆ Fine-Grain Driving (-20~30% power)

◆ Flexible Stage-Ratio (-20~30% power) 

◆ … … …



Performance


◆ Bookend Flip-Flop (+10% speed)

◆ Fast ICG/Flip-Flop (+10% speed) 

◆ Fast XOR/XNR (+10~40% speed) 

◆ TxG-in Flip-Flop (+20% speed) 

◆ High-Drive Flip-Flop (+10% speed) 

◆ … … …


Area


◆ 1-inv Flip-Flop (-8~12% area)

◆ Comb. + DFF (-3~10% area) 

◆ Small-Area Adder (-10% area) 

◆ … … …



The Key to the Best Performance of Kirin 9000 (TSMC 5nm)


Hisilicon Kirin 9000 VS Qualcomm Snapdragon 865+

◆ CPU Performance:Increase 10%

◆ Power Effiffifficiency:Increase 25%




Hisilicon Kirin 9000 VS Qualcomm Snapdragon 865+.png

    Hisilicon Kirin 9000 TSMC5nm VS Apple A12 Bionic


    手机CPU的得分差异

    各芯片的主要区别和优势


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