Chip Difffferentiation
◆ Support TSMC 3nm, 5nm, 7nm, 12nm, 16nm, 28/22nm
◆ Characterization (re-K) for many voltages @T16, 12, 10, 7, 5, 4, 3nm
Power ◆ Multi-Bit Flip-Flop (-20~30% power) ◆ Low-Power ICG (-20~30% power) ◆ 1-inv Flip-Flop (-40% power) ◆ Low-Power Comb. (-20~30% power) ◆ Fine-Grain Driving (-20~30% power) ◆ Flexible Stage-Ratio (-20~30% power) ◆ … … … | Performance ◆ Bookend Flip-Flop (+10% speed) ◆ Fast ICG/Flip-Flop (+10% speed) ◆ Fast XOR/XNR (+10~40% speed) ◆ TxG-in Flip-Flop (+20% speed) ◆ High-Drive Flip-Flop (+10% speed) ◆ … … … | Area ◆ 1-inv Flip-Flop (-8~12% area) ◆ Comb. + DFF (-3~10% area) ◆ Small-Area Adder (-10% area) ◆ … … … |
The Key to the Best Performance of Kirin 9000 (TSMC 5nm)
Hisilicon Kirin 9000 VS Qualcomm Snapdragon 865+ ◆ CPU Performance:Increase 10% ◆ Power Effiffifficiency:Increase 25% | Hisilicon Kirin 9000 TSMC5nm VS Apple A12 Bionic 手机CPU的得分差异 各芯片的主要区别和优势 |