240 Hard Core Scientific and Technological Achievements of the Chinese Academy of Sciences Transformed in Guangxi

Introduction: One hundred major scientific and technological achievements of the Chinese Academy of Sciences were transformed into Guangxi, and China Science Wireless Semiconductor exhibited "the first robot bionic cerebellar chip, GaN joint chip, making robots smarter, more flexible, more stable and better used"-----------------------Article Reproduction:八桂科创公众号Guangxi will further expand its recruitment of talent and technology to transform scientific and technological achievements. On June 24, the transformation of 100 major scientific and technological achievements of the Chinese Academy of Sciences into Guangxi was held in Nanning. 240 hard core and heavyweight technological achievements were showcased brilliantly. This is the first time that the Chinese Academy of Sciences has carried out large-scale, systematic and organic scientific and technological cooperation with Guangxi. Sun Ruijun, Secretary of the Party Leadership Group and Director of the Department of Science and Technology of Guangxi Zhuang Autonomous Region, and Feng Guoxing, Deputy Director of the Development Planning Bureau of the Chinese Academy of Sciences attended the event and delivered a speech.On June 24, the transformation of 100 major scientific and technological achievements of the Chinese Academy of Sciences into Guangxi was held in Nanning. Image provided by the Science and Technology Department of the Autonomous RegionThis activity focused on Guangxi's urgent needs in key areas such as artificial intelligence, high-end equipment manufacturing, advanced new materials, and accurately connected with major scientific and technological achievements carefully screened and recommended by the Chinese Academy of Sciences. After efficient organizational preparation and in-depth communication in the early stage, the event achieved fruitful results: a total of 25 projects reached cooperation intentions, with a total signing amount of 88.75 million yuan. At the event site, 21 key projects including "Research and Application of High Performance Wide Width Aluminum Alloy Preparation Technology for Ultra Large FLNG Ships" were signed, and the institute and enterprise successfully formed a "marriage alliance".21 key projects were signed on-site. Image provided by the Science and Technology Department of the Autonomous RegionDevelop the most advanced cerebellar and joint chips in China, making robots smarter, more flexible, and more user-friendly; By utilizing cutting-edge gene editing and cloning technologies, animal organs can meet surgical requirements and safeguard human health; Developing new technologies for intelligent electric mining and achieving environmentally friendly and efficient rare earth mining... In order to allow the public to more intuitively experience the charm of cutting-edge technology, the Chinese Academy of Sciences has selected 65 cutting-edge scientific and technological achievements for physical display, and simultaneously released 240 achievements through online platforms. These achievements cover numerous cutting-edge fields and provide new ideas and technological support for the development of advantageous characteristic industries in Guangxi.Advanced technological achievements have attracted the audience. Image provided by the Science and Technology Department of the Autonomous RegionThe release of major scientific and technological achievements in terms of supply and demand is the highlight of the event. The reporter could see that four Guangxi enterprises and four research institutes of the Chinese Academy of Sciences took the stage in turn to release the supply and demand of major scientific and technological achievements in the fields of artificial intelligence, biological manufacturing, new materials and marine medicine, respectively. Both sides have deeply analyzed their own advantages and cooperation needs, building a solid bridge for further deepening industry university research cooperation. At the same time, the Guangxi Science and Technology Achievement Transformation Fund also conducted a detailed promotion on site. The relevant person in charge elaborated on the background and key support directions of the fund, aiming to provide solid financial support for the transformation and implementation of scientific and technological achievements, and help scientific and technological achievements move from laboratories to production lines.Major scientific and technological achievements supply and demand release. Image provided by the Science and Technology Department of the Autonomous RegionSubsequently, the attending guests went together to visit the technology achievement exhibition event held at the same time. They listened carefully to the explanations, deeply understood the major scientific and technological achievements made by the Chinese Academy of Sciences in various fields, and also had a clearer understanding of the phased achievements made by Guangxi since the implementation of the "14th Five Year Plan" for scientific and technological innovation, which witnessed Guangxi's solid steps on the road of scientific and technological innovation.This event was jointly sponsored by the Department of Science and Technology of the Autonomous Region and the Chinese Academy of Sciences Guangzhou Branch. With the theme of "China Science and Technology Joins Guangxi, Creating the Future", the event further deepened the scientific and technological innovation cooperation between Chinese Academy of Sciences and Guangxi by organizing the Chinese Academy of Sciences and its affiliated institutes to jointly carry out the release, docking, signing and exhibition activities of major scientific and technological achievements with Guangxi universities, research institutes and enterprises, and inject more innovative vitality into the high-quality development of Guangxi's industry.More than 300 representatives of the Chinese Academy of Sciences, relevant departments of the autonomous region and enterprises participated in the relevant activities.来源：广西云客户端广西云-广西日报|记者 李新雄

来源：广西中科蓝谷无线半导体
Zhongke Semiconductor Robot Power System Chip Appears in

In order to deeply study and implement the spirit of the Third Plenary Session of the 20th CPC Central Committee, promote the deep integration of scientific and technological innovation and industrial innovation, and promote the landing and transformation of scientific and technological achievements of the Chinese Academy of Sciences in Guangxi, the Department of Science and Technology of Guangxi Zhuang Autonomous Region, together with the Chinese Academy of Sciences Guangzhou Branch, held the "China Science and Technology Eight Guangxi · Creating the Future: Chinese Academy of Sciences 100 Major Scientific and Technological Achievements into Guangxi Transformation Activity" in Nanning International Convention and Exhibition Center, and set up a two-way high-speed channel for the transformation of scientific and technological achievements.This activity focused on 65 scientific and technological achievements of the Chinese Academy of Sciences, 120 major scientific and technological achievements of the autonomous region, and 89 key popular science achievements. It focused on the major scientific and technological achievements of the Chinese Academy of Sciences in basic research, key core technology research, achievement transformation, and the implementation effect of the "cutting-edge" action in science and technology in Guangxi. The scientific and technological achievements were presented in the form of popular science, and the latest trends in the integration and development of scientific and technological innovation and industrial innovation were closely felt and experienced.CT Unit Wireless Semiconductor, based on gallium nitride materials, has been deeply involved in the research and development of robot power system chips and process manufacturing, and has been invited to be an exhibitor in this event. Zhongke Blue Valley Semiconductor (Guangxi) Co., Ltd. is a wholly-owned subsidiary of Zhongke (Shenzhen) Wireless Semiconductor Co., Ltd. The company plans to build a third-generation semiconductor wafer production line in Guangxi.The company is showcasing its unique process AI ASIC technology chip based on compound gallium nitride (GaN) material, which is professionally applied in the field of artificial intelligence power systems. To solve the widely existing performance constraints in the power system of embodied robots at present, especially in terms of delay, heat management, and energy efficiency, this chip adopts a half bridge topology array GaN HEMT device to reduce the volume of the half bridge drive circuit and achieve the goal of small volume and large energy. The chip achieves a switching frequency of over 1MHz and an energy conversion efficiency of over 98.5%, which is a 40% improvement compared to traditional Si based solutions. At the same time, the temperature rise Δ T ≤ 25K @ full load further enhances the stability and reliability of the system. It is a power system chip specially designed for actuators and motor drives on the joints of embodied robots, industrial robots, and medical robots. It reduces the development cost of multiple platforms for customers, achieves seamless integration from "fully integrated" to "scalable", and meets the differentiated needs of industrial automation, new energy equipment, and embodied intelligence fields.The team relies on independent intellectual property rights of gallium nitride materials and characteristic GaN array integrated chip process technology, especially in the research and development of gallium nitride epitaxial doping technology and silicon-based embedded gallium nitride manufacturing process, continuously making breakthroughs. The company's "embodied robot power system series chips" cover software and hardware collaborative design and core device processes. This chip is designed for joint actuators and motor drivers, cerebellar controllers, electronic skin, simulated muscles, and IMU physical model attitude and motion control technology in application scenarios such as embodied robots, industrial robots, and medical robots.

来源：广西中科蓝谷无线半导体
Zhongke Semiconductor releases its first embodied robot power system chip

The Zhongke Semiconductor team has launched the first GaN based programmable embodied robot power system chip, which adopts SIP packaging technology and is equipped with a hardware acceleration engine, high-speed interface, PWM signal array programmable unit, edge image processing, and high-speed interface for various sensors and biological information acquisition. Mainly used in the field of multi joint embodied robots and intelligent equipment.The artificial intelligence power system chip released by Zhongke Semiconductor this time controls 100 simulated muscle and servo motor systems through the array PWM current signal output by the chip's built-in "edge physics model" (referring to the constraints of deep learning and physical laws, energy conservation, sensors and vision added to the neural network through data-driven methods) based on inference large models (such as ChatGPT, open AI, DeepSeek generated 3D virtual models and pose coordinates) to complete complex atomic operations, with a single pose motion of 32 degrees of freedom. By using the "edge physics model" to output PWM signals to control physical quantity signals, the robot can have complex limb movements and physical quality constraints similar to humans.The company's research team has been deeply engaged in this field for many years, and this chip technology has obtained multiple invention patents and won the second and third prizes in the ICCV International Artificial Intelligence Competition in the past two years. In 2024, it won the international artificial intelligence visual tactile CVPR championship.In recent years, artificial intelligence has developed rapidly, especially since 2018, with the rise of generative artificial intelligence driving model training and the construction of a large number of algorithm centers. In less than two years, the "model training phase" has been completed. Within less than three years, language inference models such as ChatGPT, openAI, and DeepSeek were successively launched. The era of artificial intelligence has undergone a rapid evolution from the "training stage" to the "inference stage" of models. With the large-scale commercial use of inference models in China by 2025, the arrival of the "artificial intelligence application stage" has also begun. Compared to hardware, AI chips are quietly changing in the "model training stage" around the rapid evolution of inference big models. From foreign chip manufacturers such as NVIDIA's GPUs to Broadcom's recent launch of the latest AI ASIC (Application Specific Integrated Circuit) chips to meet the needs of different fields of artificial intelligence applications, coupled with China's strong promotion of artificial intelligence+low altitude economy construction, there is an opportunity for the development of AI ASIC dedicated chips. The company will continue to deepen its research and development of chips and "AI physical models" in this field.

来源：广西中科蓝谷无线半导体
New product I: Zhongke CT Unit launches GaN X-band power amplifier

                The CT-83XX series gallium nitride (GaN) high gain X-band wave power amplifier has been launched by the CT-Unite team of Zhongke. It adopts advanced heat dissipation packaging technology and is applied in unmanned aerial vehicles, unmanned equipment, remote wireless bridges, and aerospace fields. The chip is simultaneously launched in two series, with models CT-83005 and CT-83095.                   This chip integrates PA, LNA, frequency filter, and switch into one. Adopting the latest advanced SiP packaging technology, it can meet modular performance configurations in different fields and provide more flexible cost options.FEATURES：        The electron mobility is as high as 1800 cm ²/(V · s), the power supply voltage is 5V, the output saturation power is 36dBm, the operating frequency band is (4 GHz~7.2 GHz), and it operates stably in an environment of 175 ℃. The MTTF (mean time between failures) exceeds 10 hours, which can meet the strict requirements of aerospace.TECHNICAL INDEX：Operating frequency: (Frq) MHz450055007200Gain: (S21) dB45.948.247.6P1dB power: (Pout) dBm30.730.6832.2Input power: (Pin) dBm-14-15-14INPUT VOLTAGEVCC=Vcc1=Vcc2=Vcc3=Vbias=5VIcq=250mAVEN=2.7VP1dB working current: (Icc) mA9408861032Output saturation power: (Pout) dBm34.436.0234.2Input power at saturation: (Pin) dBm000Operating current at saturation: (Icc) mA149520001420    

来源：广西中科蓝谷无线半导体
Witness the growth of Zhongke! 2024

来源：广西中科蓝谷无线半导体
CT-Unite from Zhongke went to Thailand to participate in the Thailand China Green Technology Transfer Exchange Conference

        近日，中科 CT-Unite 赴泰国参加泰中科技协会第二届泰中绿色科技技术转移交流会。    此次交流会聚焦于中国与东盟国家在科技创新领域共同关切的绿色低碳发展方向。中科团队以第三代半导体新材料氮化镓为核心，围绕新能源汽车功率芯片、无人机组件及智慧燃气表等产品的封装和生产技术，展开生产转移及市场对接相关事宜交流。    交流会当日，中科团队与泰中科技协会进行了深入的交流，并针对芯片封装落地泰国项目展开了初步对接，泰国国王枢密院大臣、泰中科技协会会长格森·瓦特纳猜教授 (Professor Emeritus Kasem Watanachai)对中科团队围绕第三代半导体技术在多款功率模块及低碳能源芯片解决方案中所取得的成果给予了高度评价。此外，格森教授还表示，2025 年正值中泰建交 50 周年，届时将会邀请泰国投资促进部、商务部的领导以及泰方院校的相关代表前往中科总部进行交流考察。在此期间，双方就未来在泰国建设的新能源功率模块封装项目展开深入探讨和研究。    泰国作为东盟第二大经济体，是各国投资者关注的焦点。近年来中国及发达国家车企强势进军泰国市场，其中包括比亚迪、长城汽车、名爵、埃安、哪吒汽车等中国车企以及丰田、本田、马自达、起亚等数十家国际车企落地投产，给泰国汽车产业带来了新的活力与机遇。2023年泰国汽车年产量高达195万辆。2024年1-8月期间泰国面向全球出口的汽车、设备及零部件总额位居全球第一位，达208.1亿美元，占泰国商品出口总额的比重为10.6%。     在泰国国家科技园，中科团队就氮化镓新能源汽车功率芯片和无人机组件解决方案与泰国国家科技发展署、投资促进委员会副主任 Sanat 博士（Dr. Sanat Wongthawethong）进行了多方会谈。会谈中，双方初步达成在新能源汽车、智能装备生产、无人机组件以及智慧燃气领域的合作意向。通过此次交流活动，不仅增进了双边之间的深入了解，更为双方未来在低碳绿色科技技术领域的芯片应用、实现在泰国本土配套生产以完善国际供应链的长远目标奠定了基础。

来源：广西中科蓝谷无线半导体
CT-Unit Gallium Nitride Chip Solution Debuts at the 2024 China ASEAN Expo

CT-Unite中科半导体氮化镓芯片解决方案，亮相2024年9月24日~28日，第21届中国—东盟博览会。本次展出第三代半导体3300V高压SiC碳化硅及650V GaN氮化镓电源功率及射频芯片组件解决方案，主要应用于手机快充、新能源汽车、智能装备、无人机、机器人领域的模块化解决方案。展出期间吸引众多观展人员及东盟企事业单位深入探讨合作模式、市场开拓、技术支持等，初步达成在无人机、氮化镓快充、农业装备及新能源汽车系列的电控模块产品协作生产与市场合作意向，本次展出收获满满。在面向“中国-东盟技术对接会”上推出公司基于第三代半导体氮化镓技术的低空经济装备及自主研发的多款智能装备电控模块产品。推介公司在无人装备及自动驾驶控制单元领域取得的多项自主知识产权及人工智能国际奖项，会后交流中获得外国友人高度认可，在东盟及一带一路国家应用市场前景广阔。

来源：广西中科蓝谷无线半导体
The Zhongke UAV chip algorithm team, together with universities, won fourth place in the International ACM Visual Space Challenge

    Recently, the ACM MM2024 Visual Space Description Challenge came to an end, with the Guangxi University team represented by Professor Gao Fang, the University of Science and Technology of China, and the Chinese Academy of Sciences The CT-UNITE drone algorithm competition team won fourth place.        ACM MM (Multimedia) is a top international conference in the field of computer vision and multimedia processing, hosted by the Association for Computing Machinery in the United States. Each year, the conference sets up a special theme of Grand Challenges. The Visual Space Description Challenge requires accurate description of the spatial relationships between objects in an image through text and image generation based on visual spatial semantic understanding.    Based on the research results of visual spatial understanding technology, the logical thinking and creative ability of robots to perceive and make self judgments through visual sensors have been realized. The breakthrough progress made in the synchronous experiment of visual spatial understanding and physical robots has injected new vitality into the field of embodied artificial intelligence. The visual spatial understanding technology that won this award has shown broad application prospects in fields such as artificial intelligence driving, embodied robots, drones, and unmanned equipment, injecting new impetus into the development of China's low altitude economy.

来源：广西中科蓝谷无线半导体
Zhongke CT Unit releases multiple SiP packaged communication chip solutions for unmanned aerial vehicles

中科CT-Unite团队研制出应用于消费级、工业级、军用级无人机的SiP封装系列芯片，同时可以应用于远程无线网桥及安防领域，该芯片同步推出三个系列，型号分别为CT-9008B、CT-9004B与CT-9002B 。 无人机研发、制造和应用是衡量一个国家科技创新和制造业水平的重要标志，未来也将会成为支撑中国经济发展的重要产业。在旺盛的市场需求和广阔的发展前景推动下，其应用范围日益广泛；无人机核心关键技术也在悄然改变，远距离、高带宽及微型云台高清图像传输和低成本、小型化的发展方向，是各大无人机品牌厂家争抢的高地。我国民用无人机经过多年发展，无论是电控、电调、无刷电机、高能电池、北斗导航、计算机视觉与机器学习技术，都处于国际领先水平。而小尺寸、低功耗、低成本、远距离、高带宽、低延时、超强抗干扰通信模组与小型化、轻量化、高像素微型云台相机是我国未来需要突破的核心技术节点，但这两项技术的核心芯片 CMOS传感器和高性能RF Transceiver被日本SONY与美国ADI占据了半壁江山。中科推出SiP封装RF系统集成解决方案，完美的解决了高集成、低功耗的小型化应用场景。该芯片集成了SoC/FPGA、Transceiver、PA、LNA frequency filter 、switch、GPS/GNSS、PMU等数字智能天线算法为一体。采用最新先进的SiP封装技术，可满足不同领域模块化的性能配置提供更灵活的成本选择。2023年3月份将正式批量生产和交付，市场定价最低配置5美元~300美元不等。技术特点：支持城市复杂环境下的通信抗干扰算法；支持智能天线跟踪算法；内置集成了中科最先进的砷化镓(PHEMT)电子迁移晶体管功率放大器。TX POWER： 25dbm~36dbm可选，工作温度175℃，结温310℃与高精度单模/双模双频GPS/GNSS定位功能。 技术指标：l 通信延时低于5ms，吞吐率1.5Mbps~100Mbps可选l 支持720p 、1080p 、4k及以上高清图像传输l 同时支持1T1R与2T2R可选配l OFDM调制，频段2.3GHz~6GHzl 调制带宽1M、5M、10M、20M、40M可选配l 视距通信5km~50km可选 该芯片解决方案可应用于各种复杂环境下的视距通信和植保、影视、电力、气象、配送、军事等领域。

来源：广西中科蓝谷无线半导体